|
MIL STD 2166 : 0
|
CONNECTION, ELECTRICAL COMPLAINT PIN |
|
IPC 9151 : D
|
PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
|
15/30331587 DC : 0
|
BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
|
BS EN IEC 61189-5-503:2017
|
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards |
|
IPC 6017 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
|
MIL P 13949 : G (1) SUPP 1
|
SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
|
IEC PAS 62190:2000
|
Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices |
|
IEC 61189-5-503:2017
|
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
|
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
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BS EN 61191-3:2017
|
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
|
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
|
PD IEC/PAS 61249-8-1:2014
|
Qualification and performance of electrical insulating compound for printed wiring assemblies |
|
IEC 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
|
BS EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
|
EN 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
|
EN 61189-5-503:2017
|
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
|
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
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18/30369151 DC : DRAFT MAY 2018
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BS EN 62899-202-7 - PRINTED ELECTRONICS - PART 202-7: MATERIALS - CONDUCTIVE INK - MEASUREMENT OF PEEL STRENGTH FOR PRINTED CONDUCTIVE LAYER ON FLEXIBLE SUBSTRATE |
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IPC 9631 GERMAN : -
|
RICHTLINIE FUER DIE ANWENDUNG DER IPC-TM-650, METHODE 2.6.27, THERMISCHER STRESS, SIMULATION DES KONVEKTIONS-REFLOW-LOETENS |
|
IPC HDBK 4691 : 2015
|
HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS |
|
SAE AS 6171/10 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS |
|
BS EN 61189-5-1:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
|
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
|
13/30295427 DC : 0
|
BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
|
I.S. EN 61191-4:2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
|
J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
|
I.S. EN 61191-3:2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
|
IPC 2222 : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
|
J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
|
J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
|
IPC 9202 : 0
|
MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
|
MIL S 13949 : H
|
SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
|
IPC 9631 : 0
|
USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
|
IPC TM 650-MDP : 2012
|
IPC TEST METHOD DEVELOPMENT PACKET |
|
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
|
IEC TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
|
BS EN 61191-4:2017
|
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
|
BS EN ISO 9455-17:2006
|
Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
|
NASA GSFC STD 6001 : 2016
|
CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE |
|
NASA MSFC STD 2907 : 2006
|
WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
|
NASA GSFC STD 8002 : 2015
|
STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX |
|
IPC 4562 : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
|
IPC 4554 : 0
|
SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
|
IPC SM 817 : A
|
GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
|
IPC A 630 : 0
|
ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
|
IPC 9707 : 0
|
SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
|
SAE AS 6171/9 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY FOURIER TRANSFORM INFRARED SPECTROSCOPY (FTIR) TEST METHODS |
|
MIL I 46838 : B
|
INSULATING COMPOUND, ELECTRICAL, SILICONE RUBBER, ROOM TEMPERATURE VULCANIZING |
|
J STD 030 : A
|
SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS |
|
CEI EN 61189-5-503 : 1ED 2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
|
IPC AM 372 : 1978
|
ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
|
ASTM D 3380 : 2014 : REDLINE
|
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates |
|
J STD 020 CHINESE : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
|
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
|
IEC PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
|
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
|
BS EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
|
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
|
PD IEC/TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
|
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
|
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
|
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
|
ISO 9455-17:2002
|
Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
|
IEC PAS 62293:2001
|
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
|
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
|
PD IEC/PAS 63015:2016
|
DEFINITION OF 'LOW-HALOGEN' FOR ELECTRONIC PRODUCTS |
|
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
|
PD IEC/PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
|
J STD 004 : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
|
EN ISO 9455-17:2006
|
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
|
MIL I 47199 : A
|
INSULATING COMPOUND, ELECTRICAL, LOW VISCOSITY, SILICONE RUBBER |
|
BS ISO 9455-17 : 2002 AMD 16425
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
|
NASA STD 8739.1 : 2016
|
WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
|
IPC 9204 : 2017
|
GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS |
|
IPC 6801 : 0
|
IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
|
IPC 4562 CHINESE : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
|
I.S. EN 61189-5-503:2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
|
EN 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
|
IEC PAS 61249-8-1:2014
|
Qualification and performance of electrical insulating compound for printed wiring assemblies |
|
13/30295424 DC : 0
|
BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
|
PD IEC/TS 62647-22:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
|
EN 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
|
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
|
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
|
J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
|
IPC 2221 FRENCH : B2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
|
EN 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |