IPC TM 650 : 0
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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TEST METHODS MANUAL
Published date
06-06-2012
Publisher
Superseded date
27-04-2026
Superseded by
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Includes over 150 industry-consensus procedures for electrical, environmental, mechanical, and chemical test on types of printed wiring boards and connectors.
| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy |
| MIL-STD-2166 Base Document:1984 | CONNECTION, ELECTRICAL, COMPLAINT PIN (NO S/S DOCUMENT) |
| 15/30331587 DC : 0 | BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| BS EN IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards |
| IPC 6017 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
| MIL P 13949 : G (1) SUPP 1 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IEC PAS 62190:2000 | Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices |
| IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| PD IEC/PAS 61249-8-1:2014 | Qualification and performance of electrical insulating compound for printed wiring assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| EN 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| IPC FC 250 : A1986 | SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| MIL-C-28809 Revision B:1988 | Circuit Card Assemblies, Rigid, Flexible, And Rigid Flex (No S/S Document) |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| MIL-PRF-71226 Base Document:1996 | ARMAMENTS AND MUNITIONS, STANDARD PROVISIONS, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT) |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| IPC 9241 : 2016 | GUIDELINES FOR MICROSECTION PREPARATION |
| MIL-PRF-31032-2 Revision C:2017 | Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or Without Plated-Through Holes, for Soldered Part Mounting |
| MIL-PRF-31032-1 Revision D:2017 | Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or Without Blind and Buried Plated-Through Holes, for Soldered Part Mounting |
| IPC 5702 : 0 | GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| MIL-F-14256 Revision F:1993 | Flux, Soldering, Liquid, Paste Flux, Solder Paste and Solder-Paste Flux, (for Electronic/Electrical use), General Specification for (S/S by J-STD-004, J-STD-005 and J-STD-006) |
| MIL-P-46843 Revision C:1989 | PRINTED WIRING ASSEMBLIES, PRODUCTION OF (NO S/S DOCUMENT) |
| MIL-DTL-917 Revision F:2014 | Electric Power Equipment, Basic Requirements for |
| MIL-PRF-31032-4 Revision C:2017 | Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting |
| MIL-PRF-31032-6 Revision B:2017 | Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| MIL-PRF-31032-3 Revision C:2017 | Printed Wiring Board, Flexible, Single and Double Layer, with or Without Plated-Through Holes, with or Without Stiffeners, for Soldered Part Mounting |
| IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| MIL-PRF-31032-5 Revision B:2017 | Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC 2141 : A:2004 | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC 4202 CHINESE : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY |
| IPC 4101 CHINESE : C2009 | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 4101 GERMAN : C | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| 18/30369151 DC : DRAFT MAY 2018 | BS EN 62899-202-7 - PRINTED ELECTRONICS - PART 202-7: MATERIALS - CONDUCTIVE INK - MEASUREMENT OF PEEL STRENGTH FOR PRINTED CONDUCTIVE LAYER ON FLEXIBLE SUBSTRATE |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| 13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 9202 : 0 | MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
| MIL-S-13949 Revision H:1993 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT) |
| IPC 9631 : 0 | USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| BS EN ISO 9455-17:2006 | Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
| NASA GSFC STD 6001 : 2016 | CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE |
| NASA MSFC STD 2907 : 2006 | WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
| NASA GSFC STD 8002 : 2015 | STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC 4554 : 0 | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
| IPC SM 817 : A | GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
| MIL-I-46838 Revision B:1981 | Insulating Compound, Electrical, Silicone Rubber, Room Temperature Vulcanizing (S/S by A-A-56023) |
| CEI EN 61189-5-503 : 1ED 2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| IPC AM 372 : 1978 | ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
| ASTM D 3380 : 2014 : REDLINE | Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| PD IEC/TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| ISO 9455-17:2002 | Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| EN ISO 9455-17:2006 | Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
| IPC FC 210 : 1985 | PERFORMANCE SPECIFICATION FOR FLAT-CONDUCTOR UNDERCARPET POWER CABLE (TYPE FCC) |
| IPC SF 818 : 1991 | GENERAL REQUIREMENTS FOR ELECTRONIC SOLDERING FLUXES |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| MIL-I-47199 Revision A:1980 | Insulating Compound, Electrical, Low Viscosity, Silicone Rubber (No S/S Document) |
| BS ISO 9455-17 : 2002 AMD 16425 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| NASA STD 8739.1 : 2016 | WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
| IPC 9204 : 2017 | GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| I.S. EN 61189-5-503:2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC PAS 61249-8-1:2014 | Qualification and performance of electrical insulating compound for printed wiring assemblies |
| 13/30295424 DC : 0 | BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| EN 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| I.S. EN ISO 9455-17:2006 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC FC 203 : 1985 | FLAT CABLE, ROUND CONDUCTOR, GROUND PLANE, SPECIFICATION FOR, |
| IPC HF 318 : A1991 | MICROWAVE END PRODUCT BOARD INSPECTION AND TEST, |
| IPC FC 220 : C1985 | SPECIFICATION FOR FLAT CABLE, FLAT CONDUCTOR, UNSHIELDED |
| IPC-9202A:2022 | Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly |
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