• IPC TM 650 : 0

    Current The latest, up-to-date edition.

    TEST METHODS MANUAL

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Includes over 150 industry-consensus procedures for electrical, environmental, mechanical, and chemical test on types of printed wiring boards and connectors.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL STD 2166 : 0 CONNECTION, ELECTRICAL COMPLAINT PIN
    IPC 9151 : D PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE
    15/30331587 DC : 0 BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    BS EN IEC 61189-5-503 : 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS (IEC 61189-5-503:2017)
    IPC 6017 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES
    MIL P 13949 : G (1) SUPP 1 SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
    IEC PAS 62190:2000 Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices
    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    PD IEC/PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1 : 2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    EN 61189-5-1 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    EN 61189-5-503 : 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    18/30369151 DC : DRAFT MAY 2018 BS EN 62899-202-7 - PRINTED ELECTRONICS - PART 202-7: MATERIALS - CONDUCTIVE INK - MEASUREMENT OF PEEL STRENGTH FOR PRINTED CONDUCTIVE LAYER ON FLEXIBLE SUBSTRATE
    IPC 9631 GERMAN : - RICHTLINIE FUER DIE ANWENDUNG DER IPC-TM-650, METHODE 2.6.27, THERMISCHER STRESS, SIMULATION DES KONVEKTIONS-REFLOW-LOETENS
    IPC HDBK 4691 : 2015 HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS
    SAE AS 6171/10 : 2016 TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS
    BS EN 61189-5-1 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    13/30295427 DC : 0 BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 9202 : 0 MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
    MIL S 13949 : H SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
    IPC 9631 : 0 USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION
    IPC TM 650-MDP : 2012 IPC TEST METHOD DEVELOPMENT PACKET
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues
    NASA GSFC STD 6001 : 2016 CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
    NASA MSFC STD 2907 : 2006 WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
    NASA GSFC STD 8002 : 2015 STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
    IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    IPC 4554 : 0 SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
    IPC SM 817 : A GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
    IPC A 630 : 0 ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES
    IPC 9707 : 0 SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
    SAE AS 6171/9 : 2016 TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY FOURIER TRANSFORM INFRARED SPECTROSCOPY (FTIR) TEST METHODS
    MIL I 46838 : B INSULATING COMPOUND, ELECTRICAL, SILICONE RUBBER, ROOM TEMPERATURE VULCANIZING
    J STD 030 : A SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
    CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    IPC AM 372 : 1978 ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS,
    ASTM D 3380 : 2014 : REDLINE Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
    J STD 020 : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    J STD 020 CHINESE : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    BS EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    ISO 9455-17:2002 Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    BS PD IEC/PAS 63015 : 2016 DEFINITION OF 'LOW-HALOGEN' FOR ELECTRONIC PRODUCTS
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    EN ISO 9455-17 : 2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
    MIL I 47199 : A INSULATING COMPOUND, ELECTRICAL, LOW VISCOSITY, SILICONE RUBBER
    BS ISO 9455-17 : 2002 AMD 16425 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
    NASA STD 8739.1 : 2016 WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES
    IPC 9204 : 2017 GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS
    IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
    IPC 4562 CHINESE : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    IEC PAS 61249-8-1:2014 Qualification and performance of electrical insulating compound for printed wiring assemblies
    13/30295424 DC : 0 BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
    PD IEC/TS 62647-22:2013 (published 2013-10) Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
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