MIL-STD-2166 Base Document:1984
|
CONNECTION, ELECTRICAL COMPLAINT PIN |
IPC 9151 : D
|
PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
15/30331587 DC : 0
|
BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
BS EN IEC 61189-5-503:2017
|
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards |
IPC 6017 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
MIL P 13949 : G (1) SUPP 1
|
SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
IEC PAS 62190:2000
|
Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices |
IEC 61189-5-503:2017
|
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
BS EN 61191-3:2017
|
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
PD IEC/PAS 61249-8-1:2014
|
Qualification and performance of electrical insulating compound for printed wiring assemblies |
IEC 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
BS EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
EN 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
EN 61189-5-503:2017
|
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
IPC J STD 002 CHINESE : C
|
SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
IPC 2222 GERMAN : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 2222 FRENCH : A2010
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
MIL-PRF-50884 Revision F:2014
|
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
IPC FC 250 : A1986
|
SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
IPC 4554 CHINESE : -
|
SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK |
MIL-C-28809 Revision B:1988
|
CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
IPC 6012 RUSSIAN : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC J STD 001 SWEDISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 DANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 003 CHINESE : B
|
SOLDERABILITY TESTS FOR PRINTED BOARDS |
MIL P 50884 : E
|
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
IPC J STD 001 RUSSIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 SPANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC S 815 : B1987
|
GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
IPC SPVC-LAT1 : 2010
|
ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA |
MIL-PRF-71226 Base Document:1996
|
ARMAMENTS AND MUNITIONS, STANDARD PROVISIONS, GENERAL SPECIFICATION FOR |
IPC J STD 005 RUSSIAN : A
|
REQUIREMENTS FOR SOLDERING FLUXES |
IPC J STD 001 TURKISH : E2010
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 004 RUSSIAN : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 ROMANIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2223 CHINESE : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
IPC A 600 SWEDISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 600 JAPANESE : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 600 CHINESE : G
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC 2221 GERMAN : B
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
MIL-PRF-55110 Revision H:2014
|
PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR |
MIL-PRF-31032-2 Revision C:2017
|
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
IPC 7092 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
IPC A 600 GERMAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 610 CZECH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-31032-1 Revision D:2017
|
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
IPC A 610 GERMAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 600 POLISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 610 HINDI : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 5704 : 0
|
CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS |
IPC A 600 RUSSIAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC 2222 CHINESE : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 5702 : 0
|
GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
IPC A 610 ESTONIAN : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC CH 65 : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC 4204 CHINESE : A2011 AMD 1 2013
|
FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
MIL-F-14256 Revision F:1993
|
FLUX, SOLDERING, LIQUID (ROSIN BASE) |
IPC CH 65 CHINESE : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
MIL-P-46843 Revision C:1989
|
PRINTED WIRING ASSEMBLIES PRODUCTION OF |
MIL-DTL-917 Revision F:2014
|
ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
IPC A 610 ITALIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-31032-4 Revision C:2017
|
PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
IPC A 610 KOREAN : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-31032-6 Revision B:2017
|
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
MIL-PRF-31032-3 Revision C:2017
|
PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
IPC HDBK 850 : 0
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
IPC SM 840 : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC 2223 GERMAN : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
IPC A 630 CHINESE : -
|
ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
IPC HDBK 830 : A
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
IPC CC 830 : B
|
QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
IPC J STD 001 HUNGARIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL-PRF-31032-5 Revision B:2017
|
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
IPC J STD 004 CHINESE : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
IPC J STD 001 GERMAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 9203 : 0
|
USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE |
IPC A 610 SWEDISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS |
IPC SM 840 CHINESE : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC A 610 HUNGARIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC HDBK 840 : 0
|
SOLDER MASK HANDBOOK |
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 4204 : A
|
FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
IPC D 949 : 1987
|
RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC A 610 CHINESE : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2141 : A
|
DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
IPC 4556 : 0
|
SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS |
IPC 4202 CHINESE : A
|
FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY |
IPC 6013 GERMAN : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC J STD 006 CHINESE : B-2
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IPC J STD 001 ROMANIAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 005 : A
|
REQUIREMENTS FOR SOLDERING PASTES |
IPC A 610 JAPANESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 VIETNAMESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 005 CHINESE : A
|
REQUIREMENTS FOR SOLDERING PASTES |
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 600 FRENCH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC 4101 CHINESE : C2009
|
SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC FC 221 : A1984
|
SPECIFICATION FOR FLAT COPPER CONDUCTORS FOR FLAT CABLES |
IPC A 610 TURKISH : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC 4101 GERMAN : C
|
SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC FC 213 : 1984
|
PERFORMANCE SPECIFICATION FOR FLAT UNDERCARPET TELEPHONE CABLE |
18/30369151 DC : DRAFT MAY 2018
|
BS EN 62899-202-7 - PRINTED ELECTRONICS - PART 202-7: MATERIALS - CONDUCTIVE INK - MEASUREMENT OF PEEL STRENGTH FOR PRINTED CONDUCTIVE LAYER ON FLEXIBLE SUBSTRATE |
IPC HDBK 4691 : 2015
|
HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS |
SAE AS 6171/10 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS |
BS EN 61189-5-1:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
13/30295427 DC : 0
|
BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
I.S. EN 61191-4:2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
I.S. EN 61191-3:2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
IPC 2222 : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 9202 : 0
|
MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
MIL-S-13949 Revision H:1993
|
SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
IPC 9631 : 0
|
USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
IPC TM 650-MDP : 2012
|
IPC TEST METHOD DEVELOPMENT PACKET |
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
IEC TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
BS EN 61191-4:2017
|
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
BS EN ISO 9455-17:2006
|
Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
NASA GSFC STD 6001 : 2016
|
CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE |
NASA MSFC STD 2907 : 2006
|
WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
NASA GSFC STD 8002 : 2015
|
STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX |
IPC 4562 : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
IPC 4554 : 0
|
SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IPC SM 817 : A
|
GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
IPC A 630 : 0
|
ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES |
IPC 9707 : 0
|
SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
SAE AS 6171/9 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY FOURIER TRANSFORM INFRARED SPECTROSCOPY (FTIR) TEST METHODS |
MIL-I-46838 Revision B:1981
|
INSULATING COMPOUND, ELECTRICAL, SILICONE RUBBER, ROOM TEMPERATURE VULCANIZING |
IPC J STD 030 : A
|
SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS |
CEI EN 61189-5-503 : 1ED 2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
IPC AM 372 : 1978
|
ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
ASTM D 3380 : 2014 : REDLINE
|
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates |
IPC J STD 020 CHINESE : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
PD IEC/TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
ISO 9455-17:2002
|
Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
IEC PAS 62293:2001
|
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
PD IEC/PAS 63015:2016
|
DEFINITION OF 'LOW-HALOGEN' FOR ELECTRONIC PRODUCTS |
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
PD IEC/PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
IPC J STD 004 : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
EN ISO 9455-17:2006
|
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
MIL-I-47199 Revision A:1980
|
INSULATING COMPOUND, ELECTRICAL, LOW VISCOSITY, SILICONE RUBBER |
BS ISO 9455-17 : 2002 AMD 16425
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
NASA STD 8739.1 : 2016
|
WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
IPC 9204 : 2017
|
GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS |
IPC 6801 : 0
|
IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
IPC 4562 CHINESE : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
I.S. EN 61189-5-503:2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
EN 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
IEC PAS 61249-8-1:2014
|
Qualification and performance of electrical insulating compound for printed wiring assemblies |
13/30295424 DC : 0
|
BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
PD IEC/TS 62647-22:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
EN 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
IPC J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IPC 2221 FRENCH : B2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
EN 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |