ANSI INCITS 368 : 2003(S2018)

Foreword
Introduction
1 Scope
2 References
   2.1 Overview
   2.2 Approved references
   2.3 References under development
   2.4 Informative references
3 Definitions
   3.1 Terms
   3.2 Acronyms
   3.3 Symbols and abbreviations
   3.4 Keywords
   3.5 Conventions
   3.6 Specification of measurement equipment
4 Overview
   4.1 General
   4.2 Open vs. closed systems related to this standard
   4.3 Structural considerations
   4.4 Relationship between requirements on bulk cable and
        requirements on interconnect assemblies
   4.5 Physical measurement points
   4.6 Concatenated configurations
   4.7 Interoperability points
   4.8 Constructions considered
   4.9 Identification, constraints and loading requirements
   4.10 Nature of requirements
   4.11 Local neighborhood concepts
   4.12 Length specifications
   4.13 S21 relationship among point to point and multidrop
        configurations
   4.14 Accommodation of receiver compensation in interconnect
        requirements
   4.15 Instrumentation and text fixture considerations
   4.16 Signals covered by this standard
   4.17 Error rate considerations
5 Summary bulk cable
6 Bulk cable samples, test fixtures and setups
   6.1 Bulk cable samples and sample preparation
   6.2 Bulk cable and printed circuit board test fixture
        specifications
   6.3 Bulk cable measurement equipment and setups
   6.4 STD calibration
7 Level 1 bulk cable tests
   7.1 SE tests
   7.2 Differential local impedance
   7.3 Differential propagation time and propagation time skew
   7.4 Differential capacitance by calculation
   7.5 Differential capacitance by frequency domain measurement
   7.6 Differential insertion loss
   7.7 Near end cross talk (NEXT)
8 Summary - interconnect assemblies
9 Interconnect assemblies samples, test fixtures, and setups
   9.1 Interconnect assembly samples and sample preparation
   9.2 Test fixtures for interconnect assemblies
   9.3 Interconnect assembly measurement equipment and setups
   9.4 STD Calibration
10 Level 1 interconnect assembly tests
   10.1 Differential impedance
   10.2 Differential propagation time and propagation time skew
   10.3 Signal integrity diagrams
   10.4 Differential to common mode conversion
   10.5 Differential insertion loss
Annexes
Annex A (normative) Single ended bulk cable requirements
Annex B (informative) Periodic structure effects
Annex C (informative) SCSI signal driver boards (SSDB)
Annex D (informative) Mirage effects in multi-drop subassembly
        TDR impedance measurement

Covers the coverage to the complete assembled interconnect including connectors, uniform bulk cable, and non-uniform bulk cable.