ASTM B 490 : 2009 : R2021
Current
The latest, up-to-date edition.
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
Hardcopy , PDF
English
10-05-2021
Committee |
B 08
|
DocumentType |
Standard Practice
|
Pages |
2
|
PublisherName |
American Society for Testing and Materials
|
Status |
Current
|
Supersedes |
1.1This practice describes a procedure for measuring the ductility of electrodeposited foils.2
1.2This practice is suitable only for the evaluation of electrodeposits having low ductility.
1.3The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.
1.4This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.
1.5The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.6This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.7This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
ASTM B 456 : 2017 | Standard Specification for Electrodeposited Coatings of Copper Plus Nickel Plus<brk/> Chromium and Nickel Plus Chromium |
ASTM B 832 : 1993 : R2018 | Standard Guide for Electroforming with Nickel and Copper |
ASTM B 456 : 2017 : R2022 | Standard Specification for Electrodeposited Coatings of Copper Plus Nickel Plus<brk/> Chromium and Nickel Plus Chromium |
ASTM B 456 : 2017 | Standard Specification for Electrodeposited Coatings of Copper Plus Nickel Plus<brk/> Chromium and Nickel Plus Chromium |
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