ASTM D 1867 : 2013
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)
Hardcopy , PDF
09-03-2020
English
01-11-2013
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
D 09
|
| DocumentType |
Standard
|
| Pages |
5
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Withdrawn
|
| Supersedes |
1.1This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.
1.2The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.3This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
| ASTM D 5109 : 2012 | Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020) |
| ASTM D 3636 : 2000 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 2002 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1711 : 2011 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 3636 : 2013 : REV A : EDT 1 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 2011 : REV A | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1711 : 2013 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 5109 : 2012 | Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020) |
| ASTM D 3636 : 2006 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 1999 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 3636 : 2019 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 3636 : 2013 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 2014 : REV A | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1711 : 2015 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1711 : 2014 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 5109 : 1999 | Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards |
| ASTM D 3636 : 2013 : REV A | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 2020 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 3636 : 2011 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 2008 | Standard Terminology Relating to Electrical Insulation |
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