ASTM D 5109 : 2012
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
Hardcopy , PDF
09-03-2020
English
01-11-2012
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
D 09
|
| DocumentType |
Test Method
|
| Pages |
9
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Withdrawn
|
| Supersedes |
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
| Procedure | Section |
| Referenced Documents | |
| Conditioning | |
| Dielectric Breakdown Voltage Parallel to Laminations | |
| Dimensional Instability | |
| Dissipation Factor | |
| Flammability Rating Test | |
| Flexural Strength, Flatwise at Elevated Temperature | |
| Flexural Strength, Flatwise at Room Temperature | |
| Oven Blister Test | |
| Peel Strength Test at Elevated Temperature | |
| Peel Strength Test at Room Temperature | |
| Permittivity | |
| Pin Holes in Copper Surface | 20 |
| Purity of Copper | |
| Scratches in Copper Surface | 21 |
| Solder Float Test | |
| Solvent Resistance | |
| Surface Resistivity | |
| Volume Resistivity | |
| Terminology | |
| Thickness & Thickness Variation | |
| Warp or Twist | |
| Water Absorption |
1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.
| ASTM D 1867 : 2013 | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020) |
| ASTM D 1531 : 2006 | Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures (Withdrawn 2012) |
| ASTM D 3636 : 2000 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1825 : 1992 : R2002 | Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing |
| ASTM D 1711 : 2002 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1531 : 1995 | Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures |
| ASTM D 1711 : 2011 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1867 : 2007 | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
| ASTM D 3636 : 2013 : REV A : EDT 1 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 2011 : REV A | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1711 : 2013 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1531 : 2001 | Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures |
| ASTM D 3636 : 2006 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1867 : 2001 | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
| ASTM D 1711 : 1999 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1825 : 2003 | Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012) |
| ASTM D 3636 : 2019 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 3636 : 2013 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1531 : 2001 : EDT 1 | Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures |
| ASTM D 1711 : 2014 : REV A | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1711 : 2015 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1711 : 2014 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 3636 : 2013 : REV A | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1711 : 2020 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 3636 : 2011 | Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials |
| ASTM D 1867 : 2013 | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020) |
| ASTM D 1711 : 2008 | Standard Terminology Relating to Electrical Insulation |
| ASTM D 1825 : 1992 : R1997 | Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing |
| ASTM D 1867 : 1996 | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
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