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ASTM D 5109 : 2012 : REDLINE
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Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
Available format(s)
PDF
Language(s)
English
Published date
01-11-2012
CONTAINED IN VOL. 10.02, 2015 Specifies the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
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