1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
1.2 The procedures appear in the following sections:
| Procedure | Section |
| Referenced Documents | 2 |
| Conditioning | 4 |
| Dielectric Breakdown Voltage Parallel to Laminations | 13 |
| Dimensional Instability | 19 |
| Dissipation Factor | 14 |
| Flammability Rating Test | 16 |
| Flexural Strength, Flatwise at Elevated Temperature | 15 |
| Flexural Strength, Flatwise at Room Temperature | 15 |
| Oven Blister Test | 17 |
| Peel Strength Test at Elevated Temperature | 10 |
| Peel Strength Test at Room Temperature | 9 |
| Permittivity | 14 |
| Pin Holes in Copper Surface | 20 |
| Purity of Copper | 5 |
| Scratches in Copper Surface | 21 |
| Solder Float Test | 8 |
| Solvent Resistance | 7 |
| Surface Resistivity | 11 |
| Volume Resistivity | 11 |
| Terminology | 3 |
| Thickness & Thickness Variation | 18 |
| Warp or Twist | 6 |
| Water Absorption | 12 |
1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.