ASTM D 7998 : 2015

1.1This test method concerns bonding and testing of wood adhesives and related adhesives using small scale tensile lap-shear samples in a manner that emphasizes transient cohesive strength as a function of bonding time and temperature.

1.2Use of thin adherends enables bondlines to be rapidly heated to elevated temperatures and maintained at those temperatures for a range of times at a controlled pressure before testing.

1.3Optional rapid forced air cooling of bonds after pressing and immediately before testing enables the effect of testing temperature on transient strength to be evaluated.

1.4Bond overlap distance is specified to ensure that failure occurs in the bondline rather than in unbonded portions of adherend strips, and also to minimize the effect of shear stress non-uniformity along the overlap during tensile testing.

1.5Standard wood or alternative non-standard materials must be of specified high quality and uniformity of structure and dimension to minimize variability of bonding and maximize stress transfer into the bonds during testing.

1.6The effect of wood variability and type, or of the properties of alternative non-wood materials, on bond strength development may be explored using the method.

1.7Optional hermetic sealing of bond overlaps during their heated pressing enables the effect of moisture on bonding to be evaluated.

1.8Thermal damage, either of pre-formed bonds or by prolonging bond forming times, may be evaluated as a function of time and elevated temperature using this test method.

1.9The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.10This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Some specific hazards statements are given in Section 10 on Hazards.