ASTM E 801 : 2006 : R2011

1.1 This practice relates to the radiological examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. Requirements expressed in this practice are intended to control the quality and repeatability of the radiological images and are not intended for controlling the acceptability or quality of the electronic devices imaged.

Note 1—Refer to the following publications for pertinent information on methodology and safety and protection: Guides E94 and E1000, and “General Safety Standard for Installation Using Non-Medical X Ray and Sealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Design and Use,” Handbook No. 114.

1.2 If a nondestructive testing agency as described in Practice E543 is used to perform the examination, the testing agency should meet the requirements of Practice E543.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.