ASTM E 865 : 2020 : REDLINE

1.1This specification covers film adhesives for bonding of honeycomb sandwich panels. The adhesives are used for new production or depot repair. The adhesives shall be suitable for forming bonds that can withstand long exposures to temperatures from −55 °C to 93 °C (−67 °F to 200 °F) and also withstand the combinations of stress, temperature, and relative humidity expected to be encountered in service. The adhesives shall be used for bonding aluminum alloy facing to nonmetallic core, edge attachments, and other components of a sandwich panel.

1.2The values stated in SI units are to be regarded as standard where only SI units are given or where SI units are given first followed by inch-pound units; where inch-pound units are given first followed by SI units, the inch-pound units are to regarded as standard.

1.3This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.4This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.