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ASTM F 1192 : 2024

Current

Current

The latest, up-to-date edition.

Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices

Available format(s)

PDF

Language(s)

English

Published date

01-05-2024

€63.33
Excluding VAT

Committee
E 10
DocumentType
Guide
Pages
12
PublisherName
American Society for Testing and Materials
Status
Current
Supersedes

1.1This guide defines the requirements and procedures for testing integrated circuits and other devices for the effects of single event phenomena (SEP) induced by irradiation with heavy ions having an atomic number Z 2. This description specifically excludes the effects of neutrons, protons, and other lighter particles that may induce SEP via different mechanisms, for example, ionization or displacement damage. SEP includes any manifestation of upset induced by a single ion strike, including soft errors (one or more simultaneous reversible bit flips), hard errors (irreversible bit flips), latchup (persistent high conducting state), transients induced in combinatorial devices which may introduce a soft error in nearby circuits, power field effect transistor (FET) burn-out, and gate rupture. This test may be considered to be destructive because it often involves the removal of device lids prior to irradiation. Bit flips are usually associated with digital devices and latchup is usually confined to bulk complementary metal oxide semiconductor (CMOS) devices, but heavy ion induced SEP is also observed in combinatorial logic programmable read-only memory (PROMs), and certain linear devices that may respond to a heavy ion induced charge transient. Power transistors may be tested by the procedure called out in Method 1080 of MIL STD 750.

1.2The procedures described here can be used to simulate and predict SEP arising from the natural space environment, including galactic cosmic rays, planetary trapped ions, coronal mass ejections (CMEs), and solar flares. The techniques do not, however, simulate heavy ion beam nuclear interaction effects. The end product of the test is a plot of the SEP cross section (the number of upsets/events per unit fluence) as a function of ion LET (linear energy transfer or ionization deposited along the ion's path through the semiconductor). This data can be combined with an expected system's heavy ion environment to estimate a system upset rate during operation.

1.3Although protons can cause SEP, they are not included in this guide. A separate guide addressing proton induced SEP is being considered.

1.4The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.5This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.6This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

DSCC 95638J:2025 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 8-BIT MICROCONTROLLER, MONOLITHIC SILICON
DSCC 96559F:2025 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, 8-BIT SERIAL/PARALLEL-IN, SERIAL-OUT SHIFT REGISTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DSCC 16209C:2025 MICROCIRCUIT, LINEAR, BIPOLAR, HIGH PRECISION QUAD OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
DSCC 11202D:2025 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 36-bit, 1.8 VOLT, 2-WORD AND 4-WORD BURST, RADIATION HARDENED, SYNCHRONOUS STATIC RANDOM ACCESS MEMORY (SSRAM), MONOLITHIC SILICON
DSCC 87695E:2025 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/LINE DRIVER WITH THREE STATE OUTPUTS, MONOLITHIC SILICON
DSCC 06223D:2025 MICROCIRCUIT, HYBRID, LINEAR, 5 VOLT, DUAL CHANNEL, DC-DC CONVERTER MICROCIRCUIT, HYBRID, LINEAR, 5 VOLT, DUAL CHANNEL, DC-DC CONVERTER
DSCC 08243C:2025 MICROCIRCUIT, DIGITAL, CMOS, RADIATION HARDENED, CLOCK NETWORK MANAGER, MONOLITHIC SILICON
DSCC 15212C:2025 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M x 32-BIT (64M), RADIATION-HARDENED, PIPELINED, SYNCHRONOUS SRAM (SSRAM), MONOLITHIC SILICON
DSCC 06224D:2025 MICROCIRCUIT, HYBRID, LINEAR, 15 VOLT, DUAL CHANNEL, DC-DC CONVERTER
DSCC 08210C:2025 MICROCIRCUIT, HYBRID, 12 VOLT, SINGLE CHANNEL, DC/DC CONVERTER
DSCC 06221D:2025 MICROCIRCUIT, HYBRID, 5 VOLT SINGLE CHANNEL, DC-DC CONVERTER
DSCC 96577E:2025 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, LOOK-AHEAD CARRY GENERATOR FOR COUNTERS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DSCC 96581F:2025 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, QUADRUPLE S-R LATCH, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DSCC V62/24626:2025 MICROCIRCUIT, BiCMOS, RADIATION-TOLERANT 3V TO 5.5 V RS-485 TRANSCEIVER WITH FLEXIBLE I/O SUPPLY AND IEC ESD PROTECTION , MONOLITHIC SILICON
DSCC V62/25635A:2025 MICROCIRCUIT, LINEAR BiCMOS (LBCSOI2), RADIATION TOLERANT, 2.7 V TO 80 V, 1.1 MHz, RADIATION TOLERANT, 2.7 V TO 80 V, 1.1 MHz, ULTRA-PRECISE, CURRENT-SENSE AMPLIFIER, MONOLITHIC SILICON
DSCC 21220A:2025 MICROCIRCUIT, LINEAR, BiCMOS, DIFFERENTIAL AMPLIFIER, MONOLITHIC SILICON GERMANIUM (SiGe)
DSCC 10232E:2025 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 32-BIT (64Mb), RADIATION-HARDENED, SRAM, MULTI-CHIP MODULE
DSCC 96877E:2025 MICROCIRCUIT, MEMORY, DIGITAL, RADIATION-HARDENED, CMOS, 128K x 8 STATIC RAM, MONOLITHIC SILICON
DSCC 18209C:2025 MICROCIRCUIT, DIGITAL-LINEAR, 12 BIT, RF SAMPLING, ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
DSCC 87554J:2025 MICROCIRCUIT, DIGITAL, CMOS, 1-OF-8 DECODER/DEMULTIPLEXER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DSCC 87609J:2025 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
DSCC 89601K:2025 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, OCTAL POSITIVE EDGED-TRIGGERED D-TYPE FLIP-FLOP WITH THREE STATE OUTPUTS AND TTL COMPATIBLE, MONOLITHIC SILICON
DSCC 89688G:2025 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, QUAD 2-INPUT MULTIPLEXER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
DSCC 12223B:2024 MICROCIRCUIT, LINEAR, OPERATIONAL AMPLIFIER, DUAL, 36 V, MONOLITHIC SILICON
DSCC 92174F:2021 Microcircuit, Digital, Advanced CMOS, 1-to-8 Minimum Skew Clock Driver, Monolithic Silicon
DSCC 19206A:2024 MICROCIRCUIT, LINEAR, PRECISION, CMOS INPUT, RRIO, WIDE SUPPLY RANGE, AMPLIFIERS, MONOLITHIC SILICON
DSCC 88628H:2024 MICROCIRCUIT, DIGITAL, CMOS, BUS CONTROLLER REMOTE TERMINAL MONOLITHIC SILICON
DSCC 89577M:2024 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, BUS CONTROLLER, REMOTE TERMINAL AND MONITOR, MONOLITHIC SILICON
DSCC V62/23628:2024 MICROCIRCUIT, DIGITAL, RADIATION TOLERANT, QUADRUPLE 2-INPUT POSITIVE-NOR GATES, MONOLITHIC SILICON
DSCC 22202A:2024 MICROCIRCUIT, HYBRID, LINEAR, SINGLE CHANNEL, DC-DC CONVERTER
DSCC V62/23605A:2024 MICROCIRCUIT, LINEAR, 0 MHz TO 11 GHz, 3 dB BANDWIDTH, ANALOG TO DIGITAL CONVERTER DRIVER AMPLIFIER, MONOLITHIC SILICON, NEXT GENERATION ENHANCED PRODUCT (NEP)
DSCC 25203:2024 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION HARDENED, Gen3, 1 GBit, 32 M x 32, MAGNETORESISTIVE RAM (MRAM), MONOLITHIC SILICON

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€63.33
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