ASTM F 2113 : 2001 : EDT 1
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
Hardcopy , PDF
11-11-2014
English
10-06-2001
Important note : Users cannot be edited or removed once added to your Multi user PDF.CONTAINED IN VOL. 10.04, 2015 Includes sputtering targets used as thin film source material in fabricating semiconductor electronic devices.
| Committee |
F 01
|
| DocumentType |
Guide
|
| Pages |
2
|
| ProductNote |
Reconfirmed EDT 1
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
1.1 This guide covers sputtering targets used as thin film source material in fabricating semiconductor electronic devices. It should be used to develop target specifications for specific materials and should be referenced therein.
1.2 This standard sets purity grade levels, analytical methods and impurity content reporting method and format.
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
| ASTM F 3192 : 2016 | Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023) |
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