ASTM F 219 : 1996
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
Hardcopy , PDF
11-11-2014
English
31-12-2010
Important note : Users cannot be edited or removed once added to your Multi user PDF.CONTAINED IN VOL. 10.04, 2018 Defines the testing of fine wire, flat or round, approximately 0.010 in. (0.25 mm) and smaller in diameter or thickness, used in electronic devices and lamps.
| Committee |
F 01
|
| DocumentType |
Test Method
|
| Pages |
3
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Superseded
|
| SupersededBy |
1.1 These test methods cover the testing of fine wire, flat or round, approximately 0.010 in. (0.25 mm) and smaller in diameter or thickness, used in electronic devices and lamps.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
| ASTM F 9 : 1969 : R1986 | Specification for Round Wire for Use as Grid Siderods in Electron Tubes (Withdrawn 1991) |
| ASTM F 72 : 2021 | Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024) |
| ASTM F 288 : 1996 : R2019 | Standard Specification for Tungsten Wire for Electron Devices and Lamps |
| ASTM F 289 : 1996 : R2019 | Standard Specification for Molybdenum Wire and Rod for Electronic Applications |
| ASTM F 288 : 1996 | Standard Specification for Tungsten Wire for Electron Devices and Lamps |
| ASTM F 487 : 2013 | Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding |
| ASTM F 73 : 1996 : R2009 | Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps |
| ASTM F 73 : 1996 : R2017 | Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps |
| ASTM F 289 : 1996 | Standard Specification for Molybdenum Wire and Rod for Electronic Applications |
| ASTM F 72 : 2017 | Standard Specification for Gold Wire for Semiconductor Lead Bonding |
| ASTM F 73 : 1996 : R2013 | Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps |
| ASTM F 288 : 1996 : R2014 | Standard Specification for Tungsten Wire for Electron Devices and Lamps |
| ASTM F 288 : 1996 : R2002 | Standard Specification for Tungsten Wire for Electron Devices and Lamps |
| ASTM F 73 : 1996 : R2002 | Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps |
| ASTM F 289 : 1996 : R2002 | Standard Specification for Molybdenum Wire and Rod for Electronic Applications |
| ASTM F 487 : 2013 : R2018 | Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024) |
| ASTM F 288 : 1996 : R2009 | Standard Specification for Tungsten Wire for Electron Devices and Lamps |
| RR-S-615 Revision C:1969 | SPONGES, METAL |
| ASTM F 289 : 1996 : R2009 | Standard Specification for Molybdenum Wire and Rod for Electronic Applications |
| ASTM F 289 : 1996 : R2014 | Standard Specification for Molybdenum Wire and Rod for Electronic Applications |
| ASTM F 73 : 1996 | Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps |
| ASTM F 289 : 1996 | Standard Specification for Molybdenum Wire and Rod for Electronic Applications |
| ASTM B 63 : 2007 | Standard Test Method for Resistivity of Metallically Conducting Resistance and Contact Materials |
| ASTM D 374 : 1999 | Standard Test Methods for Thickness of Solid Electrical Insulation |
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