ASTM F 3192 : 2016
Current
The latest, up-to-date edition.
Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)
Hardcopy , PDF
English
18-10-2016
Important note : Users cannot be edited or removed once added to your Multi user PDF.CONTAINED IN VOL. 10.04, 2016 Specifies the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
| Committee |
F 01
|
| DocumentType |
Standard
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| Pages |
5
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Current
|
1.1This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
1.2Sputtering target purity, grain size, inner quality, bonding, dimension, and appearance specifications are included in this specification along with references for qualification test methods. Reliability, certification, traceability, and packaging requirements are also included.
1.2.1Purity Requirements:
1.2.1.1Metallic element impurities, and
1.2.1.2Non-metallic element impurities.
1.2.2Grain Size Requirements—Grain size.
1.2.3Inner Quality Requirements—Internal defect.
1.2.4Bonding Requirements:
1.2.4.1Backing plate, and
1.2.4.2Bonding ratio.
1.2.5Configuration Requirements:
1.2.5.1Dimension,
1.2.5.2Tolerance, and
1.2.5.3Surface roughness.
1.2.6Appearance Requirements—Surface cleanness.
1.3The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.4This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
| ASTM F 2113 : 2001 : EDT 1 | Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications |
| ASTM E 1001 : 2016 : REDLINE | Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves |
| ASTM F 2405 : 2004 | Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer |
| ASTM F 1512 : 1994 : R1999 | Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies |
| ASTM B 209 : 2014 | Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate |
| ASTM E 1001 : 2021 | Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves |
| ASTM F 2405 : 2004 : R2011 | Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2020) |
| ASTM F 2113 : 2001 : R2011 | Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020) |
| ASTM E 1001 : 2011 | Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves |
| ASTM E 1001 : 1999 : REV A | Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves |
| ASTM F 1512 : 1994 : R2003 | Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies |
| ASTM B 248 : 2017 | Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar |
| ASTM E 1001 : 2016 | Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves |
| ASTM F 2113 : 2001 | Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications |
| ASTM B 209 : 2014 : REDLINE | Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate |
| ASTM E 1001 : 2006 | Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves |
| ASTM F 1512 : 1994 : R2011 | Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020) |
| ASTM E 112 : 2013 : R2021 | Standard Test Methods for Determining Average Grain Size |
| ASTM E 112 : 2013 | Standard Test Methods for Determining Average Grain Size |
| ASTM B 248 : 2022 | Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar |
| ASTM E 1001 : 2004 | Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves |
| ASTM B 248 : 2017 : REDLINE | Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar |
| ASTM F 2113 : 2001 : R2007 | Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications |
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