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ASTM F 459 : 2013
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
Hardcopy , PDF
03-12-2023
English
01-01-2013
CONTAINED IN VOL. 10.04, 2018 Defines tests to determine the pull strength of a series of wire bonds.
Committee |
F 01
|
DocumentType |
Test Method
|
Pages |
5
|
ProductNote |
Reconfirmed 2013
|
PublisherName |
American Society for Testing and Materials
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
1.1These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).
1.2These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see Fig. 1) to be placed under the wire.
1.3The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2
1.4These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.
1.5A nondestructive procedure is described in Practice F458.
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