ASTM F 72 : 2021
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
Hardcopy , PDF
26-04-2024
English
11-01-2024
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
B 02
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| DocumentType |
Standard
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| Pages |
11
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| PublisherName |
American Society for Testing and Materials
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
1.1This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.
Note 1:Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the identity of modifying additives is not restricted.
1.2The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard.
1.3The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.4This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
| ASTM F 205 : 1994 : R2020 | Standard Test Method for Measuring Diameter of Fine Wire by Weighing (Withdrawn 2023) |
| ASTM F 219 : 1996 | Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps |
| ASTM F 16 : 2012 : R2022 | Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps (Withdrawn 2023) |
| ASTM F 16 : 2012 : R2017 | Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps |
| ASTM F 219 : 1996 : R2018 | Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps (Withdrawn 2023) |
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