BIS IS 11516 : 2005(R2016)
Current
The latest, up-to-date edition.
SOFT SOLDER FOR ELECTRONIC APPLICATIONS - SPECIFICATION
12-01-2013
FOREWORD
1 SCOPE
2 REFERENCES
3 CONDITIONS OF SUPPLY
4 MANUFACTURE
5 CHEMICAL COMPOSITION
6 FORM AND SIZE
7 FREEDOM FROM DEFECTS
8 SAMPLING AND INSPECTION
9 METHODS OF TEST
10 RE-TEST
11 PACKING AND MARKING
ANNEX A - PROPERTIES AND APPLICATIONS OF SOLDERS
Includes the requirements of soft solders (antimonial and non-antimonial) in the form of sticks, bars and ingots for use in electronic applications.
| Committee |
MTD 9
|
| DocumentType |
Standard
|
| PublisherName |
Bureau of Indian Standards
|
| Status |
Current
|
| BIS IS 998-1 : 1983(R2003) | METHODS FOR CHEMICAL ANALYSIS OF SOLDERS (SOFT AND ROSIN CORED) - PART 1: DETERMINATION OF TIN AND ANTIMONY |
| BIS IS 998-3 : 1983(R2003) | METHODS FOR CHEMICAL ANALYSIS OF SOLDERS (SOFT AND ROSIN CORED) - PART 3: DETERMINATION OF CADMIUM, ZINC, ALUMINIUM, BISMUTH AND NICKEL |
| BIS IS 998-2 : 1983(R2003) | METHODS FOR CHEMICAL ANALYSIS OF SOLDERS (SOFT AND ROSIN CORED) - PART 2: DETERMINATION OF IRON, COPPER AND ARSENIC |
| BIS IS 1387 : 1993(R2003) | GENERAL REQUIREMENTS FOR THE SUPPLY OF METALLURGICAL MATERIALS |
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