BS 3934-5:1997
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Hardcopy , PDF
English
15-09-1997
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INTRODUCTION
1 Scope
2 Terms and definitions
3 Description of tape automated bonding (TAB)
4 Dimensional requirements
4.1 Film format
4.2 Alignment holes
4.3 Body size
4.4 Test pad patterns
4.5 Outer lead patterns
4.6 Maximum lead count
5 Variation codes
6 Requirements for inner and outer lead bonding (LIB
and OLB)
Figures
Tables
Notes to figures and tables
Annexes
A Summary of recommended TAB package configurations
(super format)
B Summary of recommended TAB package configurations
(wide format)
C Outer lead numbering
D Test pad numbering
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
| Committee |
EH/3
|
| DevelopmentNote |
Also numbered as IEC 60191-5 Supersedes 93/216730 DC and BS 3934-5(1992) (07/2005)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
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