BS 4584-102.11(1990) : 1990 AMD 8416
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPEC. FOR THIN EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEER, GENERAL PURPOSE GRADE, FOR USE IN FABRICATION OF MULTILAYER BOARDS
15-02-1995
23-11-2012
National foreword
Committees responsible
Specification
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Gives requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Although intended for multilayer boards, the materials may be used for single sided or double sided printed boards. Includes materials and construction, internal marking, electrical properties, non electrical properties of the copper clad sheet, non electrical properties of the base material after complete removal of the copper foil, packaging and marking and acceptance testing. BS AMD 8416 RENUMBERS THIS STANDARD TO BS EN 60249 PT2-11: 1995
Committee |
ECL/19
|
DevelopmentNote |
Renumbered and superseded by BS EN 60249-2.11. Supersedes 89/22206 DC. (09/2005)
|
DocumentType |
Standard
|
PublisherName |
British Standards Institution
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
IEC 60249-2-11:1987 | Identical |
BS 6221-22:1990 | Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology |
IEC 60249-3A:1976 | First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials |
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