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BS 4584-102.11(1990) : 1990 AMD 8416

BS 4584-102.11(1990) : 1990 AMD 8416

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPEC. FOR THIN EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEER, GENERAL PURPOSE GRADE, FOR USE IN FABRICATION OF MULTILAYER BOARDS

Superseded date

15-02-1995

Published date

23-11-2012

Publisher

British Standards Institution

National foreword
Committees responsible
Specification
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
   complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing

Gives requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Although intended for multilayer boards, the materials may be used for single sided or double sided printed boards. Includes materials and construction, internal marking, electrical properties, non electrical properties of the copper clad sheet, non electrical properties of the base material after complete removal of the copper foil, packaging and marking and acceptance testing. BS AMD 8416 RENUMBERS THIS STANDARD TO BS EN 60249 PT2-11: 1995

Committee
ECL/19
DevelopmentNote
Renumbered and superseded by BS EN 60249-2.11. Supersedes 89/22206 DC. (09/2005)
DocumentType
Standard
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

Standards Relationship
IEC 60249-2-11:1987 Identical

BS 6221-22:1990 Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology

IEC 60249-3A:1976 First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials

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