BS 4584-102.13(1990) : 1990 AMD 8421
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
15-12-1994
23-11-2012
Provides requirements for properties of flexible copper clad polyimide film, general purpose grade. With optional requirements only by agreement between purchaser and supplier. Copper clad film complying with all the requirements not marked "optional" should be deemed to comply with this specification. Includes internal marking, electrical properties, non electrical properties of the copper clad film, non electrical properties of the base material after complete removal of the copper foil, packaging and marking, acceptance testing and additional requirements. BS AMD 8421 RENUMBERS THIS STANDARD TO BS EN 60249 PT2-13
| Committee |
ECL/19
|
| DevelopmentNote |
Renumbered and superseded by BS EN 60249-2.13. Supersedes 89/22208 DC. (09/2003)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 60249-2-13:1987 | Identical |
| BS 6221-22:1990 | Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology |
| IEC 60249-3A:1976 | First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials |
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