BS 4584-102.13(1990) : 1990 AMD 8421

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE

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Superseded date: 15-12-1994

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Published date: 23-11-2012

Publisher: British Standards Institution

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Provides requirements for properties of flexible copper clad polyimide film, general purpose grade. With optional requirements only by agreement between purchaser and supplier. Copper clad film complying with all the requirements not marked "optional" should be deemed to comply with this specification. Includes internal marking, electrical properties, non electrical properties of the copper clad film, non electrical properties of the base material after complete removal of the copper foil, packaging and marking, acceptance testing and additional requirements. BS AMD 8421 RENUMBERS THIS STANDARD TO BS EN 60249 PT2-13

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Committee	ECL/19
Development Note	Renumbered and superseded by BS EN 60249-2.13. Supersedes 89/22208 DC. (09/2003)
Document Type	Standard
ISBN
Pages
Published
Publisher	British Standards Institution
Status	Superseded
Superseded By	BS EN 60249-2-13:1994

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 60249-2-13:1987	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS 6221-22:1990	Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology

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IEC 60249-3A:1976	First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials

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