• BS 4584-103.1:1990

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  24-04-2012

    Language(s):  English

    Published date:  28-02-1990

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    National foreword
    Committees responsible
    Specification
    1. Scope
    2. Designations
    3. Materials and construction
    4. Bonding sheet material
    5. Methods of test for bonding sheet material
    Figure
    1. Position of specimens for resin content, resin
        flow, volatiles content and thickness

    Abstract - (Show below) - (Hide below)

    Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Also numbered as IEC 60249-3-1 Supersedes 89/23231 DC and BS 4584-11(1977) (08/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 7825-3.2:1997 Calibration of rubber and plastics test equipment. Calibration schedules Electrical properties
    BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
    BS 123600-003:2001 System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
    BS 123300-003:2001 System of quality assessment. Capability detail specification. Rigid multilayer printed boards
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