BS 5909:1980
Current
The latest, up-to-date edition.
Method for scale adhesion test for oxygen-free copper
Hardcopy , PDF
English
30-04-1980
Important note : Users cannot be edited or removed once added to your Multi user PDF.Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
| Committee |
NFE/34
|
| DevelopmentNote |
Also numbered as ISO 4746 (09/2005)
|
| DocumentType |
Standard
|
| Pages |
6
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This International Standard specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper.
| Standards | Relationship |
| UNE-EN 13848-3:2010 | Identical |
| BS 6017:1981 | Specification for copper refinery shapes |
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