BS 6221-21:2001

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Classification of defects
5 General
6 Health and safety
7 Removal and restoration
   of protective coatings
8 Defective conductors
9 Lifted conductors
10 Lifted and defective lands
   associated with plain holes
11 Eyelet and tubular pin defects
12 Defective plated-through holes
   (double-sided boards)
13 Base laminate material defects
   (single- and double-sided boards)
14 Inclusions
15 Rework on inner layers of multilayer
   printed boards after lamination
16 Rework of printed
   edge contacts
Bibliography
Figure 1 - Defective conductors
Figure 2 - Tinned copper wire connections
Figure 3 - Insulated wire connections
Figure 4 - Straight conductor rework
           using parallel gap
           welding
Figure 5 - Lifted conductors
Figure 6 - Rework of damaged land
           using overlaid land
Figure 7 - Replacement bonded land
Figure 8 - Lifted land and conductor
Figure 9 - Eyelet and tubular pin
           defects
Figure 10- Rework of defective plated-
           through hole by the wire
           link method
Figure 11- Rework of defective plated-
           through holes (vias) by
           the eyelet method
Figure 12- Rework of defective plated-
           through holes (vias) by
           parallel gap welding: method 1
Figure 13- Rework of defective plated-
           through holes (vias) by
           parallel gap welding: method 2
Figure 14- Damaged base laminate materials
Table 1 - Type 1 defects
Table 2 - Type 2 defects
Table 3 - Applicability of methods for the
           rework of defective conductors