BS 9761:1988
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Sectional specification for capability approval of manufacturers of multilayer rigid printed wiring boards of assessed quality with plated through holes
Hardcopy , PDF
15-12-2000
English
31-10-1988
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Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base materials
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description capability
Section three. Quality conformance inspection
3.1 General
3.2 Certified test records
Appendices
A CTP dimensions and finish for multilayer boards
with PTHs
B Locations of specimens on CTP for multilayer boards
C Layout of composite V layers
D Layout of specimens A, B and G
E Layout of specimen C
F Layout of specimens D and E
G Layout of specimens F and K
H Layout of specimens L and N
J Layout of specimen J
K Layout of specimens M and H
L CTPs for multilayer boards, including hole sizes
M CTP layout
N Construction of multilayer CTPs for capability
approval
P Example of format for abstract of description of
capability for inclusion in PD 9002
Q Format for customer detail specification for rigid
printed wiring boards with PTHs complying with
BS 9761
Tables
1 Allocation of CTP specimens
2 Schedule of tests for capability approval for
multilayer boards with PTHs
3 Quality conformance inspection: multilayer printed
wiring boards with PTHs
4 CTP hole sizes
Figures
1 Examples of acceptable and non-acceptable soldered
holes
2 CTP for multilayer boards with PTHs
3 CTP layout
4 Example of eight-layer construction
5 Example of twelve-layer construction
Specifies applicable tests and requirements taken from those listed in BS 9760. Also requirements for capability approval and quality conformance during manufacture.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| BS 9760:1977 | Specification for printed circuits of assessed quality: generic data and methods of test: capability approval procedure and rules |
| BS 4584-10:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10 |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 4584-3:1972 | Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3 |
| BS 4584-9:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9 |
| BS 4584-2:1972 | Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2 |
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