BS 9762:1988
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Sectional specification for capability approval of manufacture of double-sided rigid printed wiring boards of assessed quality with plated through holes
Hardcopy , PDF
15-12-2000
English
31-10-1988
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base metals
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description of capability
Section three. Quality conformance inspection
3.1 General
3.2 Certified test records
Appendices
A CTP dimensions and finish for double-sided boards
with PTHs
B Group pattern layout for double-sided boards with
PTHs
C Detailed dimensions of specimens shown in appendix
B
D CTP layout
E Example of format for abstract of description of
capability for inclusion in PD 9002
F Format for customer detail specification for
printed wiring boards with PTHs complying with
BS 9762
G Solder resist and marking ink masks
H Test pattern for bonded heat sinks
Tables
1 CTP allocation
2 Schedule of tests for capability approval for
double-sided boards with PTHs
3 Quality conformance inspection: double-sided
printed wiring boards with PTHs
Figures
1 Examples of acceptable and non-acceptable soldered
holes
2 CTP for double-sided boards with PTHs
3 CTP layout
4 Solder resist mask
5 Marking ink mask
6 Test pattern for bonded heat sinks
Specifies applicable tests and requirements taken from those listed in BS 9760. Also requirements for capability approval and quality conformance during manufacture.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| BS 4584-10:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10 |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 4584-3:1972 | Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3 |
| BS 4584-9:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9 |
| BS 4584-2:1972 | Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2 |
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