Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base metals
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description of capability
Section three. Quality conformance inspection
3.1 General
3.2 Certified test records
Appendices
A CTP dimensions and finish for double-sided boards
with PTHs
B Group pattern layout for double-sided boards with
PTHs
C Detailed dimensions of specimens shown in appendix
B
D CTP layout
E Example of format for abstract of description of
capability for inclusion in PD 9002
F Format for customer detail specification for
printed wiring boards with PTHs complying with
BS 9762
G Solder resist and marking ink masks
H Test pattern for bonded heat sinks
Tables
1 CTP allocation
2 Schedule of tests for capability approval for
double-sided boards with PTHs
3 Quality conformance inspection: double-sided
printed wiring boards with PTHs
Figures
1 Examples of acceptable and non-acceptable soldered
holes
2 CTP for double-sided boards with PTHs
3 CTP layout
4 Solder resist mask
5 Marking ink mask
6 Test pattern for bonded heat sinks