Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base metals
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description of capability
Section three. Quality conformance inspection
3.1 General
3.2 Certified test records
Appendices
A CTP dimensions and finish for single- and double-
sided boards without PTHs
B Group pattern layout for single- and double-sided
boards without PTHs
C Detailed dimensions of specimens shown in appendix
B
D CTP layout
E Example of format for abstract of description of
capability for inclusion in PD 9002
F Format for customer detail specification for
single- and double-sided printed wiring boards with
PTHs complying with BS 9763
G Solder resist and marking ink masks
H Test pattern for bonded heat sinks
Tables
1 CTP allocation
2 Schedule of tests for capability approval for
single- and double-sided boards without PTHs
3 Quality conformance inspection: single- and double-
sided printed wiring boards without PTHs
Figures
1 CTP for single and double-sided boards without PTHs
2 CTP layout
3 Solder resist mask
4 Marking ink mask
5 Test pattern for bonded heat sinks