BS 9764:1988
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Sectional specification for capability approval of manufacturers of single- or double-sided flexible printed wiring boards of assessed quality without through hole connections and with or without rigidizing component materials
Hardcopy , PDF
15-12-2000
English
31-10-1988
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Foreword
Committees responsible
Specification
Section one. General
1.1 Scope
1.2 Related documents
1.3 Base metals
1.4 Customer detail specification
1.5 Inspection
Section two. Capability approval and quality
conformance inspection of flexible
printed wiring boards
2.1 Description of capability: limits of approval
2.2 Demonstration of capability
2.3 Capability CTP allocation
2.4 Capability approval acceptance levels
2.5 Capability approval report
2.6 Abstract of description of capability
2.7 Quality conformance inspection
Section three. Extension of assessment and quality
conformance inspection for flexi-rigid
printed wiring boards
3.1 Inspection
3.2 Description of capability: limits of approval
3.3 Demonstration of capability: extension for flexi-
rigid printed wiring boards
Appendices
A CTP dimensions and finish for flexible boards
without through hole connections
B Group pattern layout for flexible boards with
through hole connections
C Detailed dimensions of specimens shown in appendix
B
D CTP layout
E Examples of delamination
F Examples of hole defects
G Format for customer detail specification for
flexible single- or double-sided printed wiring
boards without through hole connections and with or
without rigidizing component materials and
complying with BS 7964
H Example of format for abstract of description of
capability for inclusion in PD 9002
J Flexible printed wiring board base materials
K CTP for flexi-rigid printed wiring boards
L Method for measurement of peel strength of flexible
board to rigidizing component
Tables
1 CTP allocation
2 Allocation of CTP specimens
3 Schedule of tests for capability approval for
flexible printed wiring boards without through hole
connections
4 Quality conformance inspection: flexible printed
wiring boards without through hole connections
5 Schedule of additional tests for extension of
capability to include flexi-rigid printed wiring
boards
6 Quality conformance inspection: flexi-rigid printed
wiring boards
7 Typical properties of materials for flexible
printed wiring boards
Figures
1 CTP for flexible boards without through hole
connections
2 CTP layout
3 CTP assembly
4 Component parts of the CTP
Specifies applicable tests and requirements taken from those listed in BS 9760. Also the requirements for capability approval and for quality conformance during manufacture.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| BS 4584-10:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10 |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 4584-3:1972 | Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3 |
| BS 4584-9:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9 |
| BS 4584-2:1972 | Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2 |
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