• BS 9765:1988

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Sectional specification for capability approval of manufacturers of double-sided flexible printed wiring boards of assessed quality with through hole connections and with or without rigidizing component materials

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  15-12-2000

    Language(s):  English

    Published date:  31-10-1988

    Publisher:  British Standards Institution

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    Foreword
    Committees responsible
    Specification
    Section one. General
    1.1 Scope
    1.2 Related documents
    1.3 Base metals
    1.4 Customer detail specification
    1.5 Inspection
    Section two. Capability approval and quality
                    conformance inspection of flexible
                    printed wiring boards
    2.1 Description of capability: limits of approval
    2.2 Demonstration of capability
    2.3 Capability CTP allocation
    2.4 Capability approval acceptance levels
    2.5 Capability approval report
    2.6 Abstract of description of capability
    2.7 Quality conformance inspection
    Section three. Extension of assessment and quality
                    conformance inspection for flexi-rigid
                    printed wiring boards
    3.1 Inspection
    3.2 Description of capability: limits of approval
    3.3 Demonstration of capability: extension for flexi-
         rigid printed wiring boards
    Appendices
    A CTP dimensions and finish for double-sided flexible
         boards without through hole connections
    B Group pattern layout for double-sided flexible
         boards with through hole connections
    C Detailed dimensions of specimens shown in appendix
         B
    D CTP layout
    E Examples of delamination
    F Examples of hole defects
    G Format for customer detail specification for
         double-sided printed wiring boards with through
         hole connections and with or without rigidizing
         component materials and complying with BS 7965
    H Example of format for abstract of description of
         capability for inclusion in PD 9002
    J Flexible printed wiring board base materials
    K CTP for flexi-rigid printed wiring boards
    L Method for measurement of peel strength of flexible
         board to rigidizing component
    Tables
    1 CTP allocation
    2 Allocation of CTP specimens
    3 Schedule of tests for capability approval for
         double-sided flexible printed wiring boards with
         through hole connections
    4 Quality conformance inspection: double-sided
         flexible printed wiring boards with through hole
         connections
    5 Schedule of additional tests for extension of
         capability to include flexi-rigid printed wiring
         boards
    6 Quality conformance inspection: flexi-rigid printed
         wiring boards
    7 Typical properties of materials for flexible
         printed wiring boards
    Figures
    1 CTP for double-sided flexible boards with through
         hole connections
    2 CTP layout
    3 CTP assembly
    4 Component parts of the CTP

    Abstract - (Show below) - (Hide below)

    Specifies applicable tests and requirements taken from those listed in BS 9760. Also the requirements for capability approval and quality conformance during manufacture.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    BS 4584-10:1977 Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10
    BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
    BS 4584-3:1972 Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, flame retardant grade: EP-GC-Cu-3
    BS 4584-9:1977 Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9
    BS 4584-2:1972 Specification for metal-clad base materials for printed circuits Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade: EP-GC-Cu-2
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective