BS CECC 23200-801:1998
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes
Hardcopy , PDF
English
15-06-1998
National foreword
Foreword
1 General
2 Capability qualifying component
3 Capability approval
4 Capability test programme
5 Additional capability
6 Traceability
Annex A - Suitable test pattern for marking inks
Annex B - Suitable test pattern for solder masks
Annex C - Suitable test pattern for bonded heatsinks
Annex D - Edge connector imperfections
Annex E - CTP subdivision for thermal shock
Annex F - Circumferential defects in plated-through holes
Annex G - Determination of characteristic impedance by TDR
Important note : Users cannot be edited or removed once added to your Multi user PDF.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.