• BS EN 165000-1:1996

    Current The latest, up-to-date edition.

    Film and hybrid integrated circuits Generic specification. Capability approval procedure

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  15-10-1996

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 General
    1.1 Scope
    1.2 Normative references
    1.3 Units, symbols and terminology
    1.4 Standard and preferred values
    1.5 Marking
    2 Quality assessment procedures
    2.1 General
    2.1.1 Eligibility for capability approval
    2.1.2 Primary stage of manufacture
    2.1.3 Subcontracting
    2.1.4 Control of procurement sources and incoming
             material
    2.1.5 Validity of release for delivery
    2.1.6 Rework
    2.2 Procedures for capability approval
    2.2.1 Application for capability approval
    2.2.2 Granting of capability approval
    2.2.3 Description of capability
    2.2.4 Capability qualifying components
    2.2.5 Demonstration and verification of capability
    2.2.6 Procedures to be followed in the event of CQC
             failures
    2.2.7 Abstract of description of capability
    2.3 Procedures following the granting of capability
             approval
    2.3.1 Maintenance of capability approval
    2.3.2 Notification of changes likely to affect the
             validity of capability approval
    2.4 Release for delivery
    2.4.1 General
    2.4.2 Quality conformance inspection requirements
    2.4.3 Detail specification
    2.4.3(1) General
    2.4.3(2) Customer detail specification
    2.4.3(3) Detail specification for standard catalogue
             circuits to be included in the Qualified
             Products List (QPL)
    3 Test and measurement procedures
    3.1 General
    3.2 Standard conditions for testing
    3.3 Visual inspections and package dimensions
    3.4 Electrical measurement procedures
    3.5 Environmental test procedures
    Figures
    1 Definition of axis for mechanical and other tests
    2 Pulling force for bond strength test
    3 Apparatus requirements for the added component
             bond strength destructive test

    Abstract - (Show below) - (Hide below)

    Prescribes the quality assessment procedures and methods of test to be used for the assessment of hybrid circuits.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Reviewed and confirmed by BSI, Feb 2005. (02/2005) Supersedes 94/216398 DC. (09/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 165000-4:1996 Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification
    BS EN 165000-5:1998 Film and hybrid integrated circuits Procedure for qualification approval
    BS 9450:1998 Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of test
    BS EN 165000-3:1996 Film and hybrid integrated circuits Self-audit checklist and report for film and hybrid integrated circuit manufacturers
    BS EN 165000-2:1996 Film and hybrid integrated circuits Internal visual inspection and special tests

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60134:1961 Rating systems for electronic tubes and valves and analogous semiconductor devices
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    EN 100012 : 1995 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
    CECC 00114 : 93 AMD 1 QUALITY ASSESSMENT PROCEDURES - APPROVAL OF MANUFACTURERS AND OTHER ORGANIZATIONS
    IEC 60068-2-47:2005 Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC TR 60440:1973 Method of measurement of non-linearity in resistors
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    CECC 00016 : 1990 BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
    IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
    CECC 00300 : 1996 REGISTER OF CECC SPECIFICATIONS
    IEC 60068-2-28:1990 Environmental testing - Part 2: Tests. Guidance for damp heat tests
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    CECC 00007 : 1978 BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES
    CECC 00400 : 86 ERRATUM 92 HANDBOOK FOR THE PRODUCTION OF CECC DOCUMENTS
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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