BS EN 60068-2-77:1999

1. Scope and object
2. Normative reference
3. Terms and definitions
4. Test methods
       4.1 Body strength
       4.2 Impact shock
5. Test
       5.1 Equipment
       5.2 Preconditioning
       5.3 Initial measurements
       5.4 Test procedure
       5.5 Recovery
       5.6 Final measurement
6. Information to be given in the relevant
       specification
Figures
Annex A (informative) - Bibliography
Annex ZA (normative) Normative references to
international publications with their corresponding
European publications

Gives test procedures applicable to surface mounting devices (SMDs) fabricated from glass or sintered materials such as capacitors, resistors and inductors incorporating ferrites. Two test methods exist: body strength and impact shock. The tests evaluate the mechanical stresses applied to SMDs during and after mounting. The relevant component specification shall specify which test method or methods apply.

This part of IEC 60747 gives the terminology, essential ratings, characteristics, safety test as well as the measuring method for photocouplers (or optocouplers). NOTE The word \'optocoupler\' can also be used instead of \'photocoupler\'. This standard replaces the clauses for photocouplers (or optocouplers) described in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments. The contents for phototransistors and photothyristors in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments, will be considered obsolete as of the effective date of publication of this standard. NOTE Photocouplers that are certified to the previous version of the photocoupler standard, namely IEC 60747-5-1/2/3, are to be considered in compliance with the requirements and provisions of IEC 60747-5-5.