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BS EN 60191-4:2014+A1:2018

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-05-2018

€271.12
Excluding VAT

This part of IEC 60191 specifies a method for the designation of package outlines and for the lassification of forms of package outlines for semiconductor devices and a systematic method or generating universal descriptive designators for semiconductor device packages.

Committee
EPL/47
DocumentType
Amendment
Pages
42
PublisherName
British Standards Institution
Status
Current
Supersedes

This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.

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