BS EN 60191-6-8:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)
Hardcopy , PDF
English
16-11-2001
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Foreword
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack. Also specifies outlines and obtain interchangeability of G-QFP.
| Committee |
EPL/47
|
| DevelopmentNote |
Also numbered as IEC 60191-6-8 Supersedes 99/203696 DC (11/2001)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
| Standards | Relationship |
| UNE-EN 60191-6-8:2002 | Identical |
| NF EN 60191-6-8 : 2002 | Identical |
| DIN EN 60191-6-8:2002-05 | Identical |
| I.S. EN 60191-6-8:2002 | Identical |
| EN 60191-6-8:2001 | Identical |
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