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BS EN 60249-2-19:1993

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Specifications Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Available format(s)

Hardcopy , PDF

Withdrawn date

01-10-2006

Language(s)

English

Published date

15-09-1992

€165.94
Excluding VAT

Committees responsible
National foreword
Specification
1. Scope
2. Normative references
3. Materials and construction
4. Internal marking
5. Electrical properties
6. Non-electrical properties of the copper-clad sheet
7. Non-electrical properties of the base material
     after complete removal of the copper foil
8. Packaging and marking
9. Acceptance testing
Tables
1. Electrical properties
2. Types, sizes and permitted number of imperfections
3. Pull-off and peel strength
4. Wetting conditions
5. Dimensional stability
6. Size tolerances for cut panels
7. Rectangularity of cut panels
8. Nominal thickness and tolerances of sheet excluding
     metal foil
9. flammability
10. Glass transition temperature and cure factor
11. Thermal coefficient of expansion

modified epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Coverage includes internal marking, electrical properties, acceptance testing and nonelectrical properties of the copper clad sheet. Also includes detailed tables.

Committee
EPL/501
DevelopmentNote
Renumbers and supersedes BS 4584-102.19(1992). 1993 version incorporates amendment 8018 to BS 4584-102.19(1992). Also numbered as IEC 60249-2-19. Supersedes 89/27825 DC. (09/2005)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials

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