BS EN 60691:2016+A1:2019
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Thermal-links. Requirements and application guide
Hardcopy , PDF
10-11-2023
English
04-06-2019
This International Standard is applicable to thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions.
Committee |
PEL/32
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DocumentType |
Standard
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ISBN |
9780580975028
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Pages |
54
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ProductNote |
THIS STANDARD ALSO REFERS TO EN 60695-2-12:2010, EN 60695-2-13:2010, EN 60065:2014/A11:2017, EN 60112:2003, EN 60695-11-10:2013, EN 60127-1:2006/A1:2011, IEC 60695-11-20:1999/AMD1:2003, EN 60695-11-20 (IEC 60695-11-20/A1) AS
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PublisherName |
British Standards Institution
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Status |
Superseded
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SupersededBy | |
Supersedes |
This International Standard is applicable to thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions.NOTE1 The equipment is not designed to generate heat.NOTE2 The effectiveness of the protection against excessive temperatures logically depends upon the position and method of mounting of the thermal-link, as well as upon the current which it is carrying.This standard may be applicable to thermal-links for use under conditions other than indoors, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard.This standard may be applicable to thermal-links in their simplest forms (e.g. melting strips or wires), provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment, especially in the case of hand-held or portable equipment, irrespective of its position.AnnexH of this standard is applicable to thermal-link packaged assemblies where the thermal-link(s) has already been approved to this standard but packaged in a metallic or nonmetallic housing and provided with terminals/wiring leads.This standard is applicable to thermal-links with a rated voltage not exceeding 690V a.c. or d.c. and a rated current not exceeding 63A.The objectives of this standard are:to establish uniform requirements for thermal-links,to define methods of test,to provide useful information for the application of thermal-links in equipment.This standard is not applicable to thermal-links used under extreme conditions such as corrosive or explosive atmospheres.This standard is not applicable to thermal-links to be used in circuits on a.c. with a frequency lower than 45Hz or higher than 62Hz.
Standards | Relationship |
IEC 60691:2015/AMD1:2019 | Identical |
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