BS EN 60749-23:2004+A1:2011
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Hardcopy , PDF
English
30-06-2011
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as “burn-in”, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this standard.
| Standards | Relationship |
| IEC 61051-1:2018 | Identical |
| EN 60749-23:2004/A1:2011 | Identical |
| IEC 60749-23:2004/AMD1:2011 | Identical |
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