BS EN 60749-29:2011
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Latch-up test
Hardcopy , PDF
English
31-08-2011
1 Scope and object
2 Terms and definitions
3 Classification and levels
4 Apparatus and material
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - Examples of special pins
that are connected to passive components
Annex B (informative) - Calculation of operating
ambient or operating case temperature for
a given operating junction temperature
Specifies the I-test and the overvoltage latch-up testing of integrated circuits. It establishes a method for determining integrated circuit latch-up characteristics and to define latch-up failure criteria.
Committee |
EPL/47
|
DevelopmentNote |
Supersedes 02/205138 DC (03/2004) Supersedes 09/30209746 DC. (09/2011)
|
DocumentType |
Standard
|
Pages |
26
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits.
This test is classified as destructive.
The purpose of this test is to establish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing \'no trouble found\' (NTF) and \'electrical overstress\' (EOS) failures due to latch-up.
This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established.
The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2
Standards | Relationship |
UNE-EN 60749-29:2004 | Identical |
NF EN 60749-29 : 2012 | Identical |
DIN EN 60749-29:2012-01 | Identical |
NBN EN 60749-29 : 2011 | Identical |
EN 60749-29:2011 | Identical |
I.S. EN 60749-29:2011 | Identical |
IEC 60749-29:2011 | Identical |
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