BS EN 60749-42:2014
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Temperature and humidity storage
Hardcopy , PDF
English
31-10-2014
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1 Scope
2 Normative references
3 Test equipment
4 Procedure
5 Failure criteria
6 Information to be given in applicable
procurement document
Annex ZA (normative) - Normative references to international
Publications with their corresponding European
publications
Defines a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 12/30263960 DC. (10/2014)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
| Standards | Relationship |
| EN 60749-42:2014 | Identical |
| IEC 60749-42:2014 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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