• BS EN 61188-5-8:2008 (published 2008-05)

    Current The latest, up-to-date edition.

    Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-05-2008

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 General information
      3.1 General component description
      3.2 Marking
      3.3 Carrier packaging format
      3.4 Process considerations
    4 BGA (square)
      4.1 Field of application
      4.2 Component descriptions
          4.2.1 Basic construction
          4.2.2 Termination materials
          4.2.3 Marking
          4.2.4 Carrier package format
          4.2.5 Process considerations
      4.3 Component dimensions (square)
          4.3.1 PBGA 1,5 mm pitch component
                dimensions (square)
          4.3.2 PBGA 1,27 mm pitch component
                dimensions (square)
          4.3.3 PBGA 1,00 mm pitch component
                dimensions (square)
      4.4 Solder joint fillet design
          4.4.1 Solder joint fillet design - Non-collapsing,
                collapsing (level 3)
      4.5 Land pattern dimensions
          4.5.1 PBGA 1,5 mm pitch land pattern
                dimensions (square)
          4.5.2 PBGA 1,27 mm pitch land pattern
                dimensions (square)
          4.5.3 PBGA 1,00 mm pitch land pattern
                dimensions (square)
    5 FBGA (square)
    6 BGA (rectangular)
      6.1 Field of application
      6.2 Component descriptions
          6.2.1 Basic construction
          6.2.2 Termination materials
          6.2.3 Marking
          6.2.4 Carrier package format
          6.2.5 Process considerations
      6.3 Component dimensions (rectangular)
      6.4 Solder joint fillet design
          6.4.1 Solder joint fillet design - Collapsing
                (level 3)
          6.4.2 Land approximation
          6.4.3 Total variation
      6.5 Land pattern dimensions
    7 FBGA (rectangular)
    8 CGA
    9 LGA
    Annex ZA (normative) - Normative references to international
                           publications with their corresponding
                           European publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands.

    Scope - (Show below) - (Hide below)

    IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

    This publication is to be read in conjunction with IEC 61188-5-1:2002.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
    EN 61188-5-1 : 2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    EN 62090:2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
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