BS EN 61189-5-4:2015
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Hardcopy , PDF
English
30-04-2015
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 C: Chemical test methods
5 X: Miscellaneous test methods
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines methodologies and procedures that can be applied to test printed board assemblies.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 12/30274804 DC. Renumbers and supersedes BS IEC 61189-5-4. 2015 Version incorporates corrigendum to BS IEC 61189-5-4. (04/2015)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.
| Standards | Relationship |
| EN 61189-5-4:2015 | Identical |
| IEC 61189-5-4:2015 | Identical |
| DIN EN 61189-5-4:2015-11 | Equivalent |
| I.S. EN 61189-5-4:2015 | Equivalent |
| UNE-EN 61189-5-4:2015 | Equivalent |
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