BS EN 61240:2012
Current
The latest, up-to-date edition.
Piezoelectric devices. Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection. General rules
Hardcopy , PDF
English
30-11-2012
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
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| DevelopmentNote |
Supersedes 93/201332 DC (11/2005) Supersedes 09/30200401 DC. (11/2012) Supersedes 15/30323430 DC. (02/2017)
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| DocumentType |
Standard
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| Pages |
22
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| PublisherName |
British Standards Institution
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| Status |
Current
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| SupersededBy | |
| Supersedes |
IEC 61240:2012 sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this standard as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs for frequency control and selection. This edition includes the following significant technical changes with respect to the previous edition:
- outline drawings have been changed from three views (top, front and bottom) to that based on ISO layout in the third-angle projection, in which the view from the right has been added to the top, front and bottom views;
- reference line and geometrical dimensions of the package for enclosures have been changed for practical use;
- information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for frequency control and selection has been included in an annex.
| Standards | Relationship |
| DIN EN 61240:2015-08 (Draft) | Identical |
| IEC 61240:2016 | Identical |
| NBN EN 61240 : 2012 | Identical |
| SN EN 61240 : 2017 | Identical |
| EN 61240:2017 | Identical |
| I.S. EN 61240:2017 | Identical |
| IEC 61240:2012 | Identical |
| ISO 5456-2:1996 | Technical drawings — Projection methods — Part 2: Orthographic representations |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| EN ISO 1101:2017 | Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out (ISO 1101:2017) |
| ISO 1101:2017 | Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
| ISO 128-30:2001 | Technical drawings General principles of presentation Part 30: Basic conventions for views |
| EN ISO 5456-2:1999 | Technical drawings - Projection methods - Part 2: Orthographic representations (ISO 5456-2:1996) |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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