• There are no items in your cart

BS EN 62047-8:2011

Current

Current

The latest, up-to-date edition.

Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films

Published date

30-06-2011

1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Test piece
6 Test procedure and analysis
7 Test report
Annex A (informative) - Data analysis: Test results by using
        nanoindentation apparatus
Annex B (informative) - Test piece fabrication: MEMS process
Annex C (informative) - Effect of misalignment and geometry
        on property measurement
Bibliography

Describes the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test.

IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.

Committee
EPL/47
DevelopmentNote
Supersedes 08/30172398 DC. (06/2011)
DocumentType
Standard
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 62047-8:2011 Identical
EN 62047-8:2011 Identical

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.