BS EN IEC 60068-2-21:2021

This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations and is also applicable to surface mount devices (SMDs). The recommended test methods suitable for specific terminations/lead of devices are shown in Table 1. Table 1 – Selection of test methods suitable for specific terminations/leads Test method Component Mounted/not mounted See Clause Test Type Ua1 Tensile Leaded devices Not mounted Clause 4 Ua2 Thrust Leaded devices Not mounted Clause 4 Ub Bending Leaded devices Not mounted Clause 5 Uc Torsion Leaded devices Not mounted Clause 6 Ud Torque Threaded stud, screw or other terminations Not mounted Clause 7 Ue1 Substrate bending Surface mount devices Mounted Clause 8 Ue2 Pull/push Surface mount devices Mounted Clause 8 Ue3 Shear Surface mount devices Mounted Clause 8 Uf1 Body strength Surface mount devices Not mounted Clause 9 Uf2 Impact shock Surface mount devices Not mounted Clause 9