BS EN IEC 60068-2-83:2025
Current
The latest, up-to-date edition.
Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Hardcopy , PDF
English
29-07-2025
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 60068-2-83:2025 is available as IEC 60068-2-83:2025 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes. NOTE?Different solderability test methods for SMD are described in IEC 60068?2?58 and IEC 60068?2?69. IEC 60068?2?58 specifies visual evaluation using solder bath and reflow method, IEC 60068?2?69 specifies wetting balance evaluation using solder bath and solder globule method. This edition includes the following significant technical change with respect to the previous edition: a) revise Clause 5 to align with that in IEC 60068?2?20:2021.
| Standards | Relationship |
| EN IEC 60068-2-83:2025 | Equivalent |
| IEC 60068-2-83:2025 | Identical |
Access your standards online with a subscription
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.
Important note : Users cannot be edited or removed once added to your Multi user PDF.