BS EN IEC 60286-3:2019
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
Hardcopy , PDF
17-01-2023
English
14-03-2019
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits.
| Committee |
W/-
|
| DocumentType |
Standard
|
| ISBN |
9780539033717
|
| Pages |
47
|
| ProductNote |
This standrad is also refers to EN 61340-5-1
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
- addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.
| Standards | Relationship |
| EN 61300-2-10:2012 | Identical |
| IEC 60286-3:2019 | Identical |
| EN IEC 60286-3:2019 | Identical |
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