BS EN IEC 60749-23:2026
Current
The latest, up-to-date edition.
High temperature operating lifeSemiconductor devices. Mechanical and climatic test methods
Hardcopy , PDF
English
03-02-2026
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as \'burn-in\', can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document. This edition includes the following significant technical changes with respect to the previous edition: a) absolute stress test definitions and resultant test durations have been updated.
| Standards | Relationship |
| EN IEC 60749-23:2026 | Equivalent |
| IEC 60749-23:2025 | Identical |
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