Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-07-2019

Publisher

British Standards Institution

This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.

The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series.

This document is applicable to the SMD of semiconductor devices and electrical components.

Committee	EPL/501
DocumentType	Standard
ISBN	9780580966422
Pages	46
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
IEC 61188-6-4:2019	Identical
EN IEC 61188-6-4:2019	Identical

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BS EN IEC 61188-6-4:2019

Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

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